TSMC’s A16 ‘1.6nm’ Node Promises 10% Speed Boost or 20% Power Cut Over 2nm, With Backside Power Hitting Production by Q4 2026

TSMC previewed its A16 1.6nm process, promising 8-10% better speed than N2P at the same voltage or 15-20% lower power at the same speed.

The node also targets up to 10% higher logic and SRAM density, strengthening TSMC’s next step in the Angstrom-era roadmap.

A16 will use Super Power Rail backside power delivery, a key architectural shift for high-performance and AI/HPC chips.

TSMC plans mass production in Q4 2026, with first products expected to appear around 2027-2028.