Focused microwaves allow 3D printers to fuse circuits onto almost anything

Researchers demonstrated a 3D-printing method that uses focused microwaves to bond circuit paths onto a variety of surfaces.

The approach can fuse conductive traces and SMD parts without broadly heating the surrounding material.

That could make it easier to build embedded circuits on objects made of different materials, from metal to plastic.

It may speed up prototyping and expand electronics integration, though cost could keep it mostly in specialized manufacturing.