NVIDIA’s Rubin Ultra Reportedly Scaled Back to Dual-Die Design Amid Supply Chain Concerns

Taiwanese reports say NVIDIA scaled Rubin Ultra back from a four-die CoWoS-L package to a dual-die design.

The company plans to preserve HBM4 capacity and compute by arranging dies on the rack board in a 2+2 configuration.

Reports cite supply chain complexity and manufacturing risks such as thermal stress and warping as reasons for the change.