Huawei’s AI Chips Lack Differentiation and Face Global Market Penetration Hurdles, but a Focus on Glass Substrates Could Ignite Its Fortunes

Huawei is reportedly building a supply chain to mass-produce AI chips with glass substrates by 2027.

The new substrate could improve chip stacking, reduce warpage and leakage, and boost power efficiency.

That would give Huawei a potential one-year lead over Samsung and other rivals in adopting the technology.

If successful, the move could strengthen Huawei’s AI hardware position despite U.S. trade sanctions.