Intel’s Advanced Packaging Is Getting the Attention It Needs From AI Customers, With EMIB Gaining Ground Against TSMC’s CoWoS

Intel’s advanced packaging business is drawing strong customer interest.

Customers have committed "billions" this year to Intel’s Advanced Packaging.

Google and Amazon are using Intel’s EMIB for ASIC projects—possibly including TPUs and Trainium.

TSMC’s CoWoS lines are fully booked by loyal customers, limiting available capacity.

Intel Foundry is the only alternative with an advanced packaging portfolio comparable to TSMC; TSMC’s packaging volume is largely concentrated in Taiwan.