The Ridiculously Nerdy Intel Bet That Could Rake in Billions

Intel is expanding chip assembly and test capacity in Penang, Malaysia as part of a packaging expansion.

Intel plans to roll out its EMIB-T advanced packaging technology in fabs this year.

Naga Chandrasekaran took over Intel Foundry in 2025 and described advanced packaging as a recent industry focus.

Analysts say packaging capacity and fab deal-making are key constraints for scaling packaging operations.