A point for China and a scare for the US: Huawei has found a way to nip at TSMC's heels

Huawei unveiled a new chip-scaling approach aimed at boosting density and performance without relying only on smaller transistors.

At a Shanghai semiconductor forum, He Tingbo introduced a time-of-signal-propagation scaling law and the LogicFolding architecture.

The company says the method could help China keep advancing chips under U.S. export restrictions and narrow the gap with leaders like TSMC, Intel, and Samsung.

Huawei’s roadmap points to performance comparable to a 1.4 nm-class node by 2031.