China’s Leading Memory Maker Hits an HBM3 Roadblock as Domestic DRAM Makers Rush HBM Manufacturing

China’s largest DRAM maker, CXMT, is reportedly having trouble moving its HBM3 program from testing into mass production, pushing the timeline from early 2026 to late 2026 or later.

Chinese memory makers are ramping HBM efforts, but they still trail in advanced stacks such as HBM3e and HBM4.

A delay in domestic HBM3 output could tighten supply for China’s AI chips and slow near-term AI datacenter buildouts.

The setback matters for the wider domestic semiconductor push, including Huawei-linked AI plans and the country’s memory roadmap heading into Semicon China 2026.