Intel’s EMIB Hits 90% Yield as Analyst Signals Foundry Breakthrough, EMIB-T Scales to >12x Reticle in 2028

Intel’s EMIB packaging is said to have reached about 90% yield, boosting confidence in its advanced packaging roadmap.

The company is positioning EMIB as a scalable alternative to TSMC’s CoWoS for AI and hyperscale chips.

Intel also outlined EMIB-M and EMIB-T upgrades aimed at lower cost, better power delivery, and larger chiplet integration.

EMIB-T is expected to extend beyond 12x reticle size by 2028, supporting more demanding AI workloads and HBM-based designs.