China’s AMEC targets more than 100 high-end semiconductor equipment types within five years

At its 22nd anniversary event, AMEC said it plans to expand its high-end semiconductor equipment lineup to more than 100 types within five years.

The company says it already has 54 types under development or in production, spanning etching, thin-film processing, CMP, and metrology tools.

AMEC will pursue the expansion through in-house development and acquisitions, while targeting first-tier global status by 2035.

The move underscores China’s push to strengthen domestic chip equipment capabilities and compete in advanced process tools.