Samsung Galaxy S27 could bring a major Exynos upgrade

Samsung is planning a major packaging change for the Exynos 2700 in the Galaxy S27.

Instead of stacking DRAM on top of the SoC, Samsung may place memory beside the chip to improve cooling.

The SBS design is expected to reduce heat, lower latency, and boost performance.

The move builds on only partial progress from the Exynos 2600 and could make future Exynos chips more competitive against Qualcomm.