TSMC: Faster chips without a new ASML machine

TSMC unveiled two new nodes: A13 for AI chips in 2029 and N2U for AI, phones, and laptops in 2028.

The company said it will keep using existing ASML EUV tools instead of moving to pricier High-NA EUV machines.

The move suggests TSMC can keep improving chip performance without taking on the most expensive new equipment.

It signals a more cost-conscious path for scaling both AI and consumer semiconductors.