ASML's roadmap for chipmaking lithography tools examined — from DUV to Low-NA, High-NA, Hyper-NA, and beyond

ASML outlined a lithography roadmap from DUV and low-NA EUV to High-NA EUV, with a future Hyper-NA concept on the horizon.

The company said it shipped 48 EUV systems and 131 DUV immersion tools in 2025, generating €32.7 billion in revenue.

ASML ended the period with a €38.8 billion backlog, underscoring sustained demand for advanced chipmaking tools.

The article highlights the tradeoff: higher resolution and throughput at newer nodes, but rising cost, complexity, and export-control risk.