Intel and SK hynix shares surge on reports of a chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

Intel and SK hynix shares jumped after a report that SK hynix is testing Intel’s EMIB 2.5D packaging for HBM-plus-logic chip integration.

The talks are unconfirmed, and neither company has publicly verified the reported R&D work.

If true, the deal could give SK hynix an alternative to TSMC’s tight CoWoS capacity.

It would also support Intel’s foundry ambitions in the fast-growing AI chip packaging market.