Intel Starts Paying Overtime Bonuses To Expedite Work On Its Ohio Fab, As EMIB-T Package Yield Approaches 90 Percent

Intel is using overtime bonuses to speed up development of its Ohio semiconductor complex.

The site is a key part of Intel’s roadmap, targeting 18A and 14A production by 2031.

EMIB-T packaging is advancing toward roughly 90% package yields and bulk availability in 2027.

But substrate yield is still the main bottleneck, hovering around 50%.

If successful, EMIB-T could become a lower-cost alternative to TSMC CoWoS-L for AI and chiplet customers.