ASML Sees Memory Chip Orders Explode Past Logic for the First Time as DRAM Makers Scramble for EUV Slots

ASML said AI-driven demand has pushed DRAM and HBM memory tool orders above logic orders for the first time.

Tight EUV and DUV capacity is forcing chipmakers to compete harder for lithography slots as memory makers expand output.

ASML reported strong Q1 2026 sales, with demand led by South Korea and Taiwan.

The company also highlighted progress on higher-throughput EUV systems, including the NXE:3800E.