SK Hynix Addresses the HBM Shortage With a 32-Soccer-Field Mega-Fab, P&T7 Dedicated to HBM Production, Ready by 2028

SK Hynix will build P&T7, a major new production complex in Cheongju, to expand HBM and advanced packaging output.

The facility will include HBM and wafer-level packaging lines, with operations slated to begin between late 2027 and early 2028.

The project also comes with a large construction and hiring plan.

The move is designed to ease the HBM shortage, boost AI memory capacity, and reinforce SK Hynix’s lead in next-generation chips.