HARDWARE·May 28, 2026Chinese university builds 3D chip design tool tailored to Huawei's 'LogicFolding' architecture — 3D design delivers increased performance and better thermal managementTom's Hardware
HARDWARE·May 26, 2026Imec builds world's first High-NA EUV-fabricated quantum dot qubit device — breakthrough could bring quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelinesTom's Hardware
HARDWARE·May 25, 2026Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces 'Tau Scaling Law' to replace Moore's LawTom's Hardware
