HARDWARE·May 28, 2026FuriosaAI Ditches GPU Playbook for 2nm Broadcom-Built Inference Chip, Claims HBM4/E Bandwidth Beats Even the Most Efficient GPUsWccftech
HARDWARE·May 20, 2026Intel’s Glass Substrate Bet Inches Closer to Reality as First Prototypes With Co-Packaged Optics Appear Ahead of 2030 RolloutWccftech
HARDWARE·May 9, 2026NVIDIA Rubin & Rubin Ultra Platforms Facing Design/Spec Issues per Rumors, While AMD MI500 Is Positioned for a 2H 2027 LaunchWccftech
HARDWARE·May 1, 2026Intel’s EMIB Hits 90% Yield as Analyst Signals Foundry Breakthrough, EMIB-T Scales to >12x Reticle in 2028Wccftech
HARDWARE·April 30, 2026DO NOT BUY: AMD Ryzen 9 9950X3D2 CPU Review & Benchmarks | 24 Charts in 24 Hours | GamersNexusGamersNexus
HARDWARE·April 29, 2026TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stackingTom's Hardware
HARDWARE·April 27, 2026TSMC details next-gen CoWoS roadmap: over 14-reticle packages and a 48x leap in compute power expected by 2029 — massive size enables 24 HBM5E stacks and a further boost in memory bandwidthTom's Hardware
