SCIENCE·May 28, 2026SK hynix builds innovative cooling solution inside a 3D stacked memory chipInteresting Engineering
HARDWARE·May 26, 2026SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centersTom's Hardware
HARDWARE·May 25, 2026Micron Warns Memory Crunch Will Outlast 2026 as AI Demand Outpaces What HBM, DRAM and NAND Can SupplyWccftech
HARDWARE·May 22, 2026Chinese memory starts entering global markets as Corsair DDR5 modules are spotted with CXMT DRAMWccftech
TECH·May 19, 2026Researchers unveil NAND-DRAM hybrid that could outperform traditional memoryTechSpot
TECH·May 18, 2026A Bitcoin-level frenzy has erupted... Money from around the world pours into AI memory ETFs디지털투데이
HARDWARE·May 13, 2026Micron Doubles Down on AI Memory With 256 GB DDR5 RDIMMs Hitting 9200 MT/s, a 40% Leap Over Today’s ModulesWccftech
HARDWARE·May 12, 2026Korea’s DRAM & NAND Export Statistics Show a Massive Jump in Prices Versus Last Month: SSD Prices Up 63%, Memory Up 29%, HBM Up 19%Wccftech
