Advanced Packaging Leads The Way To Intel Foundry Success

Intel Foundry’s near-term strength is increasingly advanced packaging, not just leading-edge process nodes like Intel 18A.

The Rio Rancho, New Mexico site is emerging as a major U.S. hub for EMIB and Foveros packaging, with added silicon photonics production.

The article also points to future glass substrate manufacturing as a possible next step, which could expand Intel’s foundry differentiation.

Overall, Intel’s foundry strategy looks more mature on packaging today than on the newest logic nodes, and that could help attract customers.