SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

SK hynix introduced iHBM, a new thermal packaging design for HBM that places integrated cooling elements near the D2D PHY.

The company says the architecture can cut thermal resistance by more than 30%, helping reduce heat buildup at the source.

The design is aimed at next-generation HBM5, AI accelerators, HPC systems, and dense AI data centers.

By easing thermal throttling at the package level, iHBM could improve sustained performance, reliability, and scalability.