TECH·8 hours agoChina Advanced Packaging Enters New Wave of Investment as 400 Billion Yuan in Projects Target Chiplet 3D Integration and AI Chip SubstratesPandaily
HARDWARE·yesterdayInnosilicon’s LPDDR6 Memory IP Lands at Major Korean DRAM Maker, as It Unveils GDDR7, HBM4, & PCIe 6.0 Technologies Spanning 28nm to 3nmWccftech
TECH·2 days agoCha Jae-hyeok, CEO of Advantest Korea: “Beyond testers, our goal is to be a differentiated solution partner in the AI and HPC era”전자신문
HARDWARE·2 days agoIntel 18A-P and 14A gain Cadence’s full EDA toolchain, tightening the ecosystem push to challenge TSMC’s foundry leadWccftech
SCIENCE·4 days agoUS lab initiative targets 5x faster engineering with next-gen supercomputingInteresting Engineering
HARDWARE·6 days agoAMD EPYC Venice CPUs Stomp NVIDIA’s Vera With 20% Faster Single-Core & 2.2x Higher Throughput, Featuring Up to 256 “Zen 6” Cores, 203 Billion Transistors & Over 5 GHz ClocksWccftech
HARDWARE·6 days agoAMD EPYC Verano “Highest Frequency” and Venice-X “3D V-Cache” CPUs Launch Next Year, Tackling Agentic AI and HPC-Oriented Workloads With Zen 6Wccftech
HARDWARE·6 days agoAMD’s Venice-X CPU launches in 2027 with 1152 MB of 3D V-Cache, 96 cores, and 5.15 GHz boost clockTom's Hardware
TECH·July 21, 2026A Guide to Choosing AWS Compute for Distributed Training (Part 1: Model Scale and Hardware Selection) | Amazon Web ServicesAWS Korea
SCIENCE·May 30, 2026EU plugs in €10 million quantum computer at supercomputing center in BarcelonaInteresting Engineering
TECH·May 29, 2026NVIDIA's AI CPU "Vera" delivers powerful performance that outperforms AMD EPYC and Intel XeonGIGAZINE
