Huawei Claims It Will Make Cutting-Edge Semiconductors By 2031

Huawei said it aims to produce cutting-edge semiconductors by 2031, saying its process could reach 1.4-nanometer-class transistor density.

The company made the remarks at a Shanghai symposium, despite US sanctions that limit access to specialized chipmaking equipment.

If Huawei succeeds without foreign tools, it could blunt the impact of US trade restrictions and narrow the gap with top chipmakers like TSMC and Samsung.