Intel’s Glass Substrate Bet Inches Closer to Reality as First Prototypes With Co-Packaged Optics Appear Ahead of 2030 Rollout

Intel showed early glass-core substrate prototypes at OFC 2026, including mockups with co-packaged optical interfaces and mixed compute/memory chiplets.

The approach is positioned as an alternative to organic substrates, which are under supply pressure, and could help ease future packaging constraints.

If it matures, the technology could support denser, faster interconnects for AI and HPC systems.

The article says Intel and partners are targeting a possible market rollout around 2029-2030.