Huawei says it can build 1.4nm chips without ASML's most advanced machines

Huawei says it is developing a chip design approach that could reach 1.4nm-class density by 2031 without using ASML’s most advanced lithography tools.

The method relies on circuit stacking and internal redesign, and Huawei plans to apply it to upcoming Kirin chips.

If successful, the strategy could reduce Huawei’s dependence on ASML and other top suppliers under US export controls.

It would also suggest an alternative path for advanced semiconductors when access to leading-edge EUV equipment is restricted.