SK hynix Turns to Intel’s EMIB Packaging as TSMC CoWoS Bottlenecks Squeeze the AI Supply Chain

SK hynix is working with Intel to evaluate EMIB advanced packaging for possible use with HBM and logic dies.

The collaboration comes as AI chipmakers face tight shortages in 2.5D packaging capacity, especially around TSMC’s CoWoS.

EMIB could emerge as an alternative to CoWoS for scaling memory-to-logic connections in AI hardware.

The move highlights how packaging has become a key bottleneck in the AI supply chain.