AMD eyes TSMC's A14 node for Zen 7, bringing angstrom-era chips to the data center

AMD is reportedly considering TSMC’s A14 process for Zen 7 server CPUs, which would be a major step into the angstrom-era for data center chips.

The roadmap also points to new architectural features including AVX10, matrix instructions, and lower-latency interrupt handling.

AMD is said to be adding memory-tagging security and other enterprise-focused capabilities such as ChkTag and FRED-like improvements.

Advanced packaging options like expanded 3D V-Cache and FOPLP are also being explored to boost performance and AI workload efficiency.