Huawei finds a way to make faster chips in the future

Huawei says its LogicFolding and Tau’s Law methods could raise chip performance without relying on EUV lithography.

The company claims the approach cuts internal delays and improves efficiency, with plans to use it in future Kirin chips.

Huawei is aiming for performance gains that could narrow the gap with leading global chipmakers by around 2031.

If successful, the strategy could reduce China’s dependence on Western suppliers and ease sanctions pressure on its AI chip ambitions.