Huawei Produces 122TB SSD Using Proprietary Chip Packaging Technology

Huawei unveiled a 122TB SSD using its proprietary Die-on-Board packaging method.

The design stacks NAND dies to achieve very high storage density despite limited access to advanced NAND suppliers.

The breakthrough highlights Huawei's strategy of using packaging innovation to work around semiconductor supply constraints.

The SSD is aimed at enterprise storage, servers, and data center use cases.