Domestic TGV Glass Substrate Industry Explodes: Chinese Manufacturers Race to Scale Through-Glass Via Technology as AI Chip Packaging Demands New Substrate Solutions

Chinese manufacturers are rapidly scaling through-glass via (TGV) glass substrate production for advanced AI chip packaging.

Capacity is expanding across glass core substrates, glass interposers, and related equipment and materials, with several firms moving toward mass production.

The technology is seen as a key enabler for denser chiplet interconnects and higher-bandwidth packaging for AI accelerators and HBM memory.

China’s buildout could reduce reliance on foreign advanced packaging supply chains and strengthen domestic semiconductor packaging capabilities.