HARDWARE·2 days agoInnosilicon’s LPDDR6 Memory IP Lands at a Major Korean DRAM Maker, as It Unveils GDDR7, HBM4, and PCIe 6.0 Technologies Spanning 28nm to 3nmWccftech
TECH·2 days agoCha Jae-hyeok, CEO of Advantest Korea: “Beyond testers, our goal is to be a differentiated solution partner in the AI and HPC era”전자신문
SCIENCE·5 days agoUS lab initiative targets 5x faster engineering with next-gen supercomputingInteresting Engineering
HARDWARE·July 24, 2026AMD EPYC Venice CPUs Stomp NVIDIA’s Vera With 20% Faster Single-Core & 2.2x Higher Throughput, Featuring Up to 256 “Zen 6” Cores, 203 Billion Transistors & Over 5 GHz ClocksWccftech
HARDWARE·July 24, 2026AMD EPYC Verano “Highest Frequency” and Venice-X “3D V-Cache” CPUs Launch Next Year, Tackling Agentic AI and HPC-Oriented Workloads With Zen 6Wccftech
HARDWARE·July 24, 2026AMD’s Venice-X CPU launches in 2027 with 1152 MB of 3D V-Cache, 96 cores, and 5.15 GHz boost clockTom's Hardware
TECH·July 21, 2026A Guide to Choosing AWS Compute for Distributed Training (Part 1: Model Scale and Hardware Selection) | Amazon Web ServicesAWS Korea
TECH·May 29, 2026NVIDIA's AI CPU "Vera" delivers powerful performance that outperforms AMD EPYC and Intel XeonGIGAZINE
HARDWARE·May 26, 2026SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centersTom's Hardware
TECH·May 26, 2026Schneider Electric delivers AI infrastructure for TeraWulf campus, set to reach 750 MWTechzine Global
SCIENCE·May 23, 2026AMD announces the industry's first CPU to enter production using TSMC 2nm process technologyInteresting Engineering
