TECH·1 hour agoU.S. National Oceanic and Atmospheric Administration retires weather forecasting supercomputer and moves to Google CloudGIGAZINE
HARDWARE·10 hours agoMemory Makers Push DDR5 MRDIMM Speeds To 16,000 MT/s, Closing The Gap On The Final 17,600 MT/s Target, As AMD Among The First To Utilize 3rd Gen MRDIMMsWccftech
HARDWARE·12 hours agoSamsung Lands Secret 2nm Cloud Giant & Says Foundry Orders Set to More Than Double in 2026Wccftech
HARDWARE·yesterdayIntel Cracks The Encapsulation Wall Blocking Hyper-Large Chips, Pushing Advanced Packaging To 24x Reticle Size and BeyondWccftech
TECH·yesterdayChina Advanced Packaging Enters New Wave of Investment as 400 Billion Yuan in Projects Target Chiplet 3D Integration and AI Chip SubstratesPandaily
HARDWARE·3 days agoInnosilicon’s LPDDR6 Memory IP Lands at a Major Korean DRAM Maker, as It Unveils GDDR7, HBM4, and PCIe 6.0 Technologies Spanning 28nm to 3nmWccftech
TECH·3 days agoCha Jae-hyeok, CEO of Advantest Korea: “Beyond testers, our goal is to be a differentiated solution partner in the AI and HPC era”전자신문
SCIENCE·6 days agoUS lab initiative targets 5x faster engineering with next-gen supercomputingInteresting Engineering
HARDWARE·July 24, 2026AMD EPYC Venice CPUs Stomp NVIDIA’s Vera With 20% Faster Single-Core & 2.2x Higher Throughput, Featuring Up to 256 “Zen 6” Cores, 203 Billion Transistors & Over 5 GHz ClocksWccftech
HARDWARE·July 24, 2026AMD EPYC Verano “Highest Frequency” and Venice-X “3D V-Cache” CPUs Launch Next Year, Tackling Agentic AI and HPC-Oriented Workloads With Zen 6Wccftech
HARDWARE·July 24, 2026AMD’s Venice-X CPU launches in 2027 with 1152 MB of 3D V-Cache, 96 cores, and 5.15 GHz boost clockTom's Hardware
TECH·July 21, 2026A Guide to Choosing AWS Compute for Distributed Training (Part 1: Model Scale and Hardware Selection) | Amazon Web ServicesAWS Korea
