TECH·11 hours agoSix U.S. senators urge Apple not to use Chinese-made memory, citing SK hynix's U.S. factoryZDNet Korea
TECH·yesterdayGoogle plans to produce up to 15 million AI chips by 2028, rivaling Nvidia's total accelerator volumeTechSpot
TECH·yesterdayTSMC Developing Advanced AI Semiconductor Packaging Technology Internally Called 'Quasi-EMIB,' Similar to Intel's Embedded Multi-die Interconnect Bridge?GIGAZINE
HARDWARE·2 days agoTSMC Concedes Intel’s EMIB Packaging Is a Strong Contender, Starts Building “Quasi-EMIB” as CoWoS Remains Choked Through 2026Wccftech
HARDWARE·2 days agoGoogle could build more AI accelerators than Nvidia sells in 2028, analyst claims — could push the company to use Intel Foundry to meet its goalsTom's Hardware
HARDWARE·3 days agoIntel Cracks The Encapsulation Wall Blocking Hyper-Large Chips, Pushing Advanced Packaging To 24x Reticle Size and BeyondWccftech
TECH·3 days agoChina Advanced Packaging Enters New Wave of Investment as 400 Billion Yuan in Projects Target Chiplet 3D Integration and AI Chip SubstratesPandaily
TECH·3 days agoDomestic TGV Glass Substrate Industry Explodes: Chinese Manufacturers Race to Scale Through-Glass Via Technology as AI Chip Packaging Demands New Substrate SolutionsPandaily
TECH·3 days ago[Analysis] SK hynix says Big Tech memory demand remains strong... signs LTA deals with 10 companies전자신문
TECH·4 days agoWill SbS, which has been giving other smartphone makers headaches, become Samsung’s ace?-36Kr36氪
HARDWARE·5 days agoGoogle’s ‘Frozen V2’ TPU hardwires SRAM onto silicon, ditching TSMC’s CoWoS packaging for GeminiWccftech
HARDWARE·5 days agoNVIDIA’s First Made-In-America GB300 GPUs Roll Off TSMC’s Arizona-Based Fab 21, But Still Fly To Taiwan for PackagingWccftech
